Designed for graphics card products
based on AMD-ATI or nVIDIA chipsets.
The ultra-high density thermal transmission
solves the "Heat Spot" problem
caused by smaller GPU die designs.
We have developed vapor chambers rated
for over 300W of heat dissipation
to meet the thermal requirements of
high end graphics cards.
For single-slot graphics cards,
we offer an ultra-thin vapor chamber
design that is just 3.0mm thick but
delivers 150W of heat dissipation.
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