Taiwan Microloops Corporation has overcome high power LED hot spot issues using our perfected Vapor Chamber Heat Spreader solution. We have researched a special solution for both, Multi-Chip LED and LED packaged emitter, to solve all hot spot issues.
The current market for high power LED is very large as the world is focusing on working towards future green energy lighting. However, the current Multi-chip solution has the following issues:
1. LED chips are placed closely causing concentrated heat flux issues.
2. LED electric circuit complexity issues.
3. Mass production Multi-Chip package yield rate issue.
4. Currently used substrates do not provide optimal heat dissipation.
Through thorough research, Microloops has found the solution to all the current issues. We present the Multi-Chip Vapor Chamber solution. Directly substitute all current used substrates (Ceramic substrate, Aluminum substrate, Copper substrate, etc¡K), we are able to directly mount all LED chips and the electric circuit board onto our Vapor Chamber with the design inquired by our customers. Through realistic testing, this solution can highly reduce each LED chip¡¦s temperature by 30-50 C. With this solution, we are able to solve LED hot spot issues, to place LED chips as closely as possible and to mount the electric circuit onto our Vapor Chamber.