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The Microloops Corporation was established
in 2002 and specializes in the development
and manufacturing of high performance thermal
components and thermal modules. Our current
capitalization is NT$190 million.
Rapid advances in semiconductor technology
have seen 90nm, 65nm and even 45nm products
appear on the market. If "Moore's Law"
is taken into account, semiconductors will
continue to pack even more transistors into
a smaller footprint. This means modern transistors
run hotter and are harder to cool, impacting
directly on performance and service life.
To solve this problem, Microloops drew on
the expertise of the aerospace industry
and began developing our Vapor Chamber Technology.
The resulting products provide very effective
heat dissipation and can be customized for
a wide variety of industry applications.
Microloops is now investing in the development
of even more advanced high-performance thermal
components such as Loop Heat Pipes (LHP),
Large-Diameter Heat Pipes (>10£r) and
Water Jackets. We also offer total cooling
modules solutions customized to customer
requirements. Our goal is to become the
leader in high-performance thermal solutions.
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